Study on diffusion bonding technology of Ti target and CuCr alloy backplane for integrated circuit (IC)

DONG Ting- yi,,, HU He- long, YU Wen- jun, HE Jin- jiang, Lü Bao- guo,

Metallic Functional Materials ›› 2017, Vol. 24 ›› Issue (6) : 23-27.

Welcome to visit Metallic Functional Materials,
Metallic Functional Materials ›› 2017, Vol. 24 ›› Issue (6) : 23-27. DOI: 10. 13228/j. boyuan. issn1005- 8192. 2017037

Study on diffusion bonding technology of Ti target and CuCr alloy backplane for integrated circuit (IC)

    {{javascript:window.custom_author_en_index=0;}}
  • {{article.zuoZhe_EN}}
Author information +
History +

HeighLight

{{article.keyPoints_en}}

Abstract

{{article.zhaiyao_en}}

Key words

QR code of this article

Cite this article

EndNote

Ris (Procite)

Bibtex

Download Citations
{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2017, 24(6): 23-27 https://doi.org/10. 13228/j. boyuan. issn1005- 8192. 2017037

References

List( Publishing order | Descend order by publishing year | Descend order by cited within ) Chart analysis

References

{{article.reference}}

Funding

RIGHTS & PERMISSIONS

{{article.copyrightStatement_en}}
{{article.copyrightLicense_en}}

Accesses

Citation

Detail
Sections
Recommended
Tel: 010-62182270　
E-mail：MFM@chinamet.cn
Powered by Beijing Magtech Co. Ltd,.
×

Share

×

Share

Copyright © Metallic Functional Materials, All Rights Reserved.

/

〈 〉